Semiconductor Projects Worth ₹4,600 Crore Approved by Cabinet in Odisha, Punjab & Andhra Pradesh
The Union Cabinet, chaired by Prime Minister Narendra Modi, has approved four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM), marking another major step towards building a robust semiconductor ecosystem in the country. With a total investment of around ₹4,600 crore, these projects will be established in Odisha, Punjab, and Andhra Pradesh, creating direct employment for 2,034 skilled professionals and generating numerous indirect jobs across the electronics manufacturing sector.
The newly approved proposals come from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies. These bring the total number of sanctioned ISM projects to ten, with cumulative investments of nearly ₹1.60 lakh crore spread across six states.
Two of the projects, SiCSem and 3D Glass Solutions, will be located in Info Valley, Bhubaneswar, Odisha. SiCSem, in collaboration with UK-based Clas-SiC Wafer Fab Ltd., will establish India’s first commercial Silicon Carbide (SiC) compound semiconductor fabrication facility. This plant will produce 60,000 wafers annually, with packaging capacity for 96 million units, catering to sectors such as defence, EVs, solar power, consumer electronics, and railways.
3D Glass Solutions will set up an advanced packaging and embedded glass substrate unit, introducing world-class semiconductor packaging technologies, including 3D Heterogeneous Integration (3DHI) modules. This facility will produce 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per year, with applications in defence, AI, photonics, high-performance computing, and automotive electronics.
In Andhra Pradesh, ASIP Technologies, in partnership with APACT Co. Ltd., South Korea, will build a facility with an annual capacity of 96 million units, producing components for mobile phones, set-top boxes, and automotive electronics.
CDIL will expand its Mohali, Punjab plant to manufacture high-power discrete devices, including MOSFETs, IGBTs, and Schottky diodes, with an annual capacity of 158.38 million units, targeting EVs, renewable energy, industrial systems, and telecom infrastructure.
These developments, along with India’s growing chip design ecosystem supported by government-backed infrastructure for 278 institutions and 72 startups, will accelerate the nation’s journey towards becoming a global semiconductor hub. Over 60,000 students have already benefited from ISM’s talent development initiatives, ensuring a skilled workforce for the industry’s future.
Source: PIB
