Thales, Radiall, Foxconn Explore Semiconductor Plant in France
French defence firm Thales, electronics component maker Radiall, and Taiwanese tech giant Foxconn have started early talks to set up a semiconductor manufacturing facility in France. The plan focuses on building capabilities for outsourced semiconductor assembly and testing (OSAT), with a goal to produce over 100 million system-in-package (SiP) units annually by 2031.
The proposed project, which aims to strengthen Europe’s semiconductor ecosystem, is expected to attract more European industrial partners and involve a total investment of more than €250 million (approximately $272 million). Foxconn shared that the facility would use advanced fan-out wafer-level packaging technology, enhancing the production of compact, high-performance chips.
The plant would cater to key sectors like aerospace, automotive, defense, and space telecom, helping Europe reduce reliance on global supply chains and build local resilience. While specific locations within France and investment timelines are yet to be confirmed, the collaboration marks a strategic step toward boosting semiconductor innovation and self-reliance in the region.
In a related move, Foxconn and Nvidia recently announced plans to establish an AI factory in Taiwan, further expanding their global technology footprint and supporting industries with the latest AI infrastructure.
Source: Yahoo Finance
