TSMC Announces Chip Design Centre in Munich

Taiwan Semiconductor Manufacturing Company (TSMC) has announced plans to open a chip design centre in Munich, Germany, by the third quarter of 2025. Company’s facility in the German city will focus on supporting European customers in designing high-performance, energy-efficient chips for automotive, industrial, IoT, and artificial intelligence (AI) applications.

Paul de Bot, President, TSMC Europe, confirmed the development during 2025 Technology Symposium. He said the Munich centre will help clients build advanced chips using TSMC’s leading-edge manufacturing technologies. While its primary focus will be on industrial and automotive sectors, it may also support AI development in the future.

Europe is actively working to strengthen its AI and semiconductor ecosystem to compete with the U.S. and China. TSMC is already part of a major initiative in the region — a €10 billion chip plant in Dresden, built through a joint venture with Infineon, NXP, and Bosch, known as the European Semiconductor Manufacturing Co (ESMC).

TSMC executive Kevin Zhang said the Munich centre could play a key role in Europe’s AI ambitions by supporting cutting-edge chip designs and will work across all ESMC chip nodes, depending on customer needs.

The move also strengthens TSMC’s presence alongside Apple, which has invested €2 billion in Munich to build its largest engineering hub in Europe. TSMC’s expansion reflects its commitment to staying close to European clients and contributing to the region’s growing semiconductor capabilities.

Source: The Economic Times