Kaynes to Deliver India’s First Packaged Semiconductor Chip by July

Mysuru-based Kaynes Semicon is set to become the first company in India to produce packaged semiconductor chips, marking a significant step in the India Semiconductor Mission 1.0. The company expects to deliver its first packaged chips by July 2024, according to CEO Raghu Panicker, who confirmed the timeline to The Economic Times (ET).

Panicker stated that the pilot production line is nearly complete, with machinery and clean room facilities expected to be ready by May. Qualification testing is scheduled for June, and the first chip samples will be delivered to US-based Alpha Omega Semiconductor in July. “We had been preparing customers, technology partners, and construction plans before approval. Once we received the green light, we moved swiftly to implement the project,” Panicker told ET.

Kaynes received Cabinet approval in September 2023 for setting up an outsourced semiconductor assembly and test (OSAT) facility in Sanand, Gujarat, with a ₹3,307-crore investment. The plant will have the capacity to produce 6.3 million chips per day.

The company has secured a multi-year agreement with Alpha Omega Semiconductor for packaging and testing 12 different semiconductor packages, including IGBT, IPM, and power MOSFETs. Alpha Omega is expected to consume 60% of Kaynes’ capacity in the first phase.

Kaynes is also expanding operations, including a new PCB manufacturing facility in Tamil Nadu and upcoming projects in Odisha and Madhya Pradesh. Meanwhile, the Indian government will contribute 50% of the investment, with 20% from Gujarat’s state government, and Kaynes covering the remaining 30%.

Source: MSN